Intel Corporation (NASDAQ:INTC) is one of the best fast growth stocks to buy according to hedge funds. On June 26, Goldman Sachs initiated coverage of the stock with a Neutral rating and $150 price target. The firm anticipates favorable trends in the server CPU market driven by agentic AI along with upside potential from Intel's foundry business. However, it also believes that the stock's recent rally has priced in much of this optimism.
On June 23, BofA Securities ******* yst Vivek Arya raised the price target on the stock to $160.00 (from $135.00) while maintaining a Buy rating. Mizuho also raised its price target on Intel Corporation (NASDAQ:INTC) a day earlier to $135 from $128, keeping the Neutral rating unchanged. The firm cited Intel's growing strength in advanced chip packaging as a potential long-term revenue driver.
The revision came after Mizuho hosted an expert call on advanced packaging, where ******* ysts examined how chipmakers are racing to find new ways to connect and stack chips together. The firm noted that this technique has become increasingly critical as traditional chip miniaturization hits its physical limits.
The call compared Intel's EMIB-T, which connects multiple chips side by side using an embedded bridge, and a competing approach from TSMC called CoWoS-L. Mizuho established that both approaches are gaining traction with customers and are seen as front-runners in the 2.5D packaging ******* e.
Mizuho's ******* ysts said insights from the expert call convinced them that Intel's EMIB-T holds a cost advantage over TSMC's CoWoS-L. They however noted that Intel will need to get its production yields up to 99% before that advantage fully converts into market share.
On June 23, BofA Securities ******* yst Vivek Arya raised the price target on the stock to $160.00 (from $135.00) while maintaining a Buy rating. Mizuho also raised its price target on Intel Corporation (NASDAQ:INTC) a day earlier to $135 from $128, keeping the Neutral rating unchanged. The firm cited Intel's growing strength in advanced chip packaging as a potential long-term revenue driver.
The revision came after Mizuho hosted an expert call on advanced packaging, where ******* ysts examined how chipmakers are racing to find new ways to connect and stack chips together. The firm noted that this technique has become increasingly critical as traditional chip miniaturization hits its physical limits.
The call compared Intel's EMIB-T, which connects multiple chips side by side using an embedded bridge, and a competing approach from TSMC called CoWoS-L. Mizuho established that both approaches are gaining traction with customers and are seen as front-runners in the 2.5D packaging ******* e.
Mizuho's ******* ysts said insights from the expert call convinced them that Intel's EMIB-T holds a cost advantage over TSMC's CoWoS-L. They however noted that Intel will need to get its production yields up to 99% before that advantage fully converts into market share.
1 month ago
