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Broadcom Inc. CEO Hock Tan said Wednesday the company is helping finance custom artificial intelligence chips for large language model developers, highlighting the enormous infrastructure costs facing AI companies such as Anthropic and OpenAI as they race to scale their models.
In the company’s second-quarter earnings call on Wednesday, Tan said Broadcom was partnering with Apollo Global Management and Blackstone to create an AI XPU platform that will fund custom AI chips for LLM developers, helping them secure the massive computing capacity needed to train and deploy increasingly advanced AI models.
The initiative is expected to deploy more than 20 gigawatts of compute capacity by 2028, with Apollo launching the platform’s first $35 billion tranche.
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