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Intel Corporation (NASDAQ:INTC) and ASML Holding N.V. (NASDAQ: ASML) have recently provided fresh evidence that High-NA EUV lithography is advancing in commercial manufacturing. At the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference, the two companies announced several updates related to this technology and next-generation chip production.
While the update offers evidence of High-NA's manufacturing readiness, Intel faces a financial test about whether production improvements translate into better foundry returns. For ASML, it is whether greater manufacturing readiness ultimately leads to broader customer adoption and demand.
According to the companies, more than one million wafers have now been processed using High-NA EUV across early tool certification and testing, research and development efforts, and volume production on select layers for a subset of Intel® Core™ Ultra Series 3 processors, code-named Panther Lake.
The products that have been manufactured on Intel 18A using High NA for select layers continue to deliver performance, the companies noted, meeting or exceeding comparable layers patterned using the NXE platform.
This offers Intel early production experience with the technology. Back in July, ASML noted how Intel was the first company to ship a high-volume logic product manufactured using ASML's High NA EUV lithography technology.

#Intel #asml #technology #production
10 hours ago

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